Ampere Computing ★ 4.7

- The Role
• As a PCB Package Design Engineer, you will be responsible for a variety of high-performance PCB layouts for Chip production. You will work with other design teams to complete the layout with minimal supervision. You will work with the Power/Signal Integrity team to verify the electrical characteristics and optimize the routing. You will check DFM and assembly drawings for manufacturing. You will interact with fabrication and assembly vendors to verify issues and keep projects on schedule.
- What The Team Wants You To Know
• The team is an integral part of the server platform process that ensures our product get the absolute highest quality products that meets their functional and performance requirements.
• Designing PCB for high-speed signals such as PCIe5, CCIX, and DDR5... is very challenging and difficult job. Low cost and high density also make it more complicated. The PCB Package Layout Team at Ampere Computing comprises of stellar folks who have dedicated themselves to make best product, collaborating with PI/SI, Hardware and Silicon engineering teams to deal problems, some challenges but very fun on working.
- What You'll Do:
• Work with a team of engineers to perform component placement and Multi-Layer HDI PCB routing.
• Talk to Mechanical team to exchange data between PCB and Mechanical.
• Build and maintain an Allegro Library database, create footprints.
• Communicate with FAB house to design and optimize PCB stackup.
• Optimize routing for high-speed signals and planes for power delivery.
• Control QA process.
• Check DFM.

- What You'll Bring:
• 1 year of PCB layout experience.
• Experience with Cadence Allegro.
• Experience in all aspects of PCB design: footprinting, netlisting, constraint setup, placement, routing.
• Understanding of High-Density Interconnect PCB layout and PCB Signal Integrity.
• General understanding of electronic circuits and chip functionality.
• Able to read and understand schematics.
• Knowledgeable with the CAM350 suite of tools and PCB fabrication processes.
• Good English communication skills, both verbal and written.
Any of the following is desirable but is not required:
• Mechanical CAD experience (Solid works or comparable).
• Knowledge desirable in CAD modeling and simulation of PCB electrical and thermal characteristics.
• Knowledgeable in high-frequency layout techniques for signal integrity, grounding, and impedance-controlled routing for high-speed.
• Have detailed knowledge of circuit design and consideration for layout, routing and timing constraints, DFM, DFA, and DFT constraints in volume manufacturing is needed for this role.
• Good knowledge of signal requirements for multi-bit busses, such as DDR3/4/5, and high-speed serial interfaces such as PCIe-gen3/4/5, SATA-gen3, and 10Gbps Ethernet.
• Knowledge of transmission lines and electromagnetic theory related to signal integrity and power integrity.
Education:
• Bachelor or Master's degree in Electronic/Computer Engineering, Computer Science, or Equivalent.

Competitive Salary and Benefit
PVI Insurance for Employee and Family
Travel Opportunities in USA, Taiwan, China, India